PPS 2200

Type: PPS 2200
Manufacturer: DATACON
Made in: 1997
Features:
Colorant:
Lower cover: dark gray powder 56.900 70 M
Upper panel: light gray powder 56.900 60 m
Upper frame: ultramarine blue RAL 5002
Control surface: water blue RAL 5021
Control: VME bus - CAN bus
Operator - Monitor - Operator - Interface:
15" flat screen monitor - Windows - similar
Operating system: Vx - Works
Network card (CONV-500):
Network connection socket:
10BaseT 10Base2 and AUI
Data storage:
Internal - Hard drive
External - 3.5" drive (high-density disks only with 1.44 MB)
Chip sizes 0.2 - 20 mm
(Manual adjustment of the ejection system kits is required)
Chip thickness & gt; 0.15 mm
Wafer sizes: up to 203 mm (8")
Frame sizes: up to 276 mm (11")
Substrate:
Substrate size (transport system)
Max. 255x203x30 mm
Component height (e.g., SMD)
Max. 30 mm with tool changer up to 10 mm
Substrate transport height (SMEMA 1.2) 940 - 945 mm or 37 - 38"
Max. Number of link points: 100 per chip type
Max. Number of individual uses: substrate 100 with free programming
60,000 in matrix programming
Max. Number of individual substrates - transport unit
(Carrier or boot) 300
Tool changer:
Max. Number of tool holders 6
Tool change time approx. 1.5 seconds
. Outdo system changer:
Max. Number of change tools 5
Tool change time approx: 4 sec. (When changing from the 1st to the 4th tool
this time is integrated into the wafer change time
and therefore not decisive)
Epoxy module:
Working area (X-Y-Z) 254x200x50 mm
Dispenser:
Feed method (standard) Measurement via feed spindle
Feed method (optional) Pressure - Time - Dosing
Cartridge sizes:
5. 10. and 30 ccm (on the additional Z axis only up to 10 ccm)
Pick & amp; Place module:
Working area (XYZ) 254x200x30 mm
Working area with additional Z axis 200x200x30 mm
Machine dimensions: 800x1200x2000 mm
Machine weight: 700 kg
Documentation - MANUAL is in German